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Title: Inverter power module with distributed support for direct substrate cooling

Patent ·
OSTI ID:1062377
 [1];  [2];  [3];  [3]
  1. San Pedro, CA
  2. Chino Hills, CA
  3. Redondo Beach, CA
+ Show Author Affiliations

Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal.

Research Organization:
National Energy Technology Laboratory (NETL), Pittsburgh, PA, Morgantown, WV (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
FC26-07NT43123
Assignee:
GM Global Technology Operations LLC (Detroit, MI)
Patent Number(s):
8,248,809
OSTI ID:
1062377
Country of Publication:
United States
Language:
English

References (1)

Effects of surface roughness on the average heat transfer of an impinging air jet journal January 2000

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