Laser diode package with enhanced cooling

Patent · Tue Jun 12 00:00:00 EDT 2012

OSTI ID:1055676

Deri, Robert J ^[1]; Kotovsky, Jack ^[2]; Spadaccini, Christopher M ^[2]

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1. Pleasanton, CA
2. Oakland, CA

A laser diode package assembly includes a reservoir filled with a fusible metal in close proximity to a laser diode. The fusible metal absorbs heat from the laser diode and undergoes a phase change from solid to liquid during the operation of the laser. The metal absorbs heat during the phase transition. Once the laser diode is turned off, the liquid metal cools off and resolidifies. The reservoir is designed such that that the liquid metal does not leave the reservoir even when in liquid state. The laser diode assembly further includes a lid with one or more fin structures that extend into the reservoir and are in contact with the metal in the reservoir.

• Research Organization: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: AC52-07NA27344
• Assignee: Lawrence Livermore National Security, LLC (Livermore, CA)
• Patent Number(s): 8,199,787
• Application Number: 13/198,393
• OSTI ID: 1055676
• Country of Publication: United States
• Language: English

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