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Title: Infrared Emissivity of Tin upon Release of a 25 GPa Shock into a LiF Window

Abstract

We measured the emissivity of a tin sample at its interface with a lithium-fluoride window upon release of a 25 GPa shock wave from the tin into the window. Measurements were made over four wavelength bands between 1.2 and 5.4 μm. Thermal emission backgrounds from the tin, glue, and lithium fluoride were successfully removed from the reflectance signals. Emissivity changes for the sample, which was initially nearly specular, were small except for the longest wavelength band, where uncertainties were high because of poor signal-to-noise ratio at that wavelength. A thin glue layer, which bonds the sample to the window, was found to heat from reverberations of the shock wave between the tin and the lithium fluoride. At approximately 3.4 μm the thermal emission from the glue was large compared to the tin, allowing a good estimate of the glue temperature from the thermal radiance. The glue appears to remain slightly colder than the tin, thereby minimizing heat conduction into or out of the tin immediately after the shock passage.

Authors:
Publication Date:
Research Org.:
Nevada Test Site/National Security Technologies, LLC (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
1055517
Report Number(s):
DOE/NV/25946-1238
DOE Contract Number:  
DE-AC52-06NA25946
Resource Type:
Journal Article
Journal Name:
Journal of Applied Physics
Additional Journal Information:
Journal Volume: 110; Journal Issue: 10
Country of Publication:
United States
Language:
English
Subject:
75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; emissivity, shock, breakout, tin, lithium fluoride, shock wave

Citation Formats

Turley, W. D., Holtkamp, D. B., Marshall, B. R., Stevens, G. D., Veeser, L. R. Infrared Emissivity of Tin upon Release of a 25 GPa Shock into a LiF Window. United States: N. p., 2011. Web. doi:10.1063/1.3657465.
Turley, W. D., Holtkamp, D. B., Marshall, B. R., Stevens, G. D., Veeser, L. R. Infrared Emissivity of Tin upon Release of a 25 GPa Shock into a LiF Window. United States. https://doi.org/10.1063/1.3657465
Turley, W. D., Holtkamp, D. B., Marshall, B. R., Stevens, G. D., Veeser, L. R. Tue . "Infrared Emissivity of Tin upon Release of a 25 GPa Shock into a LiF Window". United States. https://doi.org/10.1063/1.3657465.
@article{osti_1055517,
title = {Infrared Emissivity of Tin upon Release of a 25 GPa Shock into a LiF Window},
author = {Turley, W. D., Holtkamp, D. B., Marshall, B. R., Stevens, G. D., Veeser, L. R.},
abstractNote = {We measured the emissivity of a tin sample at its interface with a lithium-fluoride window upon release of a 25 GPa shock wave from the tin into the window. Measurements were made over four wavelength bands between 1.2 and 5.4 μm. Thermal emission backgrounds from the tin, glue, and lithium fluoride were successfully removed from the reflectance signals. Emissivity changes for the sample, which was initially nearly specular, were small except for the longest wavelength band, where uncertainties were high because of poor signal-to-noise ratio at that wavelength. A thin glue layer, which bonds the sample to the window, was found to heat from reverberations of the shock wave between the tin and the lithium fluoride. At approximately 3.4 μm the thermal emission from the glue was large compared to the tin, allowing a good estimate of the glue temperature from the thermal radiance. The glue appears to remain slightly colder than the tin, thereby minimizing heat conduction into or out of the tin immediately after the shock passage.},
doi = {10.1063/1.3657465},
url = {https://www.osti.gov/biblio/1055517}, journal = {Journal of Applied Physics},
number = 10,
volume = 110,
place = {United States},
year = {2011},
month = {11}
}