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Title: Final Report - CMA SUBSTRATE FOR POWER SEMICONDUCTOR PACKAGING

Authors:
Publication Date:
Research Org.:
Halfmoon Power Tecnologies, LLC
Sponsoring Org.:
USDOE Office of Science (SC)
OSTI Identifier:
1054104
Report Number(s):
DOE/ER/85198
DOE Contract Number:  
FG02-08ER85198
Type / Phase:
SBIR
Resource Type:
Technical Report
Country of Publication:
United States
Language:
English
Subject:
32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION; AlN, aluminum nitride, packaging material, semiconductor packaging, DBC, power semiconductor, LED, laser diode, hybrid vehicle

Citation Formats

Chen, Yuejian. Final Report - CMA SUBSTRATE FOR POWER SEMICONDUCTOR PACKAGING. United States: N. p., 2012. Web.
Chen, Yuejian. Final Report - CMA SUBSTRATE FOR POWER SEMICONDUCTOR PACKAGING. United States.
Chen, Yuejian. Mon . "Final Report - CMA SUBSTRATE FOR POWER SEMICONDUCTOR PACKAGING". United States.
@article{osti_1054104,
title = {Final Report - CMA SUBSTRATE FOR POWER SEMICONDUCTOR PACKAGING},
author = {Chen, Yuejian},
abstractNote = {},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2012},
month = {11}
}

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