Final Report - CMA SUBSTRATE FOR POWER SEMICONDUCTOR PACKAGING
Technical Report
·
OSTI ID:1054104
- Research Organization:
- Halfmoon Power Tecnologies, LLC
- Sponsoring Organization:
- USDOE Office of Science (SC)
- DOE Contract Number:
- FG02-08ER85198
- OSTI ID:
- 1054104
- Type / Phase:
- SBIR
- Report Number(s):
- DOE/ER/85198
- Country of Publication:
- United States
- Language:
- English
Similar Records
High-power single spatial mode AlGaAs channeled-substrate-planar semiconductor diode lasers for spaceborne communications. Final report, 16 July 1987-15 October 1988
Hardened hybrid semiconductor packages. Task II. Final report, 1 Jan--31 Jan 1975
Characterization of an oxygen plasma process for cleaning packaged semiconductor devices. Final report
Technical Report
·
Thu Jun 01 00:00:00 EDT 1989
·
OSTI ID:1054104
Hardened hybrid semiconductor packages. Task II. Final report, 1 Jan--31 Jan 1975
Technical Report
·
Thu May 01 00:00:00 EDT 1975
·
OSTI ID:1054104
Characterization of an oxygen plasma process for cleaning packaged semiconductor devices. Final report
Technical Report
·
Fri Nov 01 00:00:00 EST 1996
·
OSTI ID:1054104