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Title: Glass composition and process for sealing void spaces in electrochemical devices

Abstract

A glass foaming material and method are disclosed for filling void spaces in electrochemical devices. The glass material includes a reagent that foams at a temperature above the softening point of the glass. Expansion of the glass fills void spaces including by-pass and tolerance channels of electrochemical devices. In addition, cassette to cassette seals can also be formed while channels and other void spaces are filled, reducing the number of processing steps needed.

Inventors:
 [1];  [2]
  1. Richland, WA
  2. Kennewick, WA
Publication Date:
Research Org.:
Pacific Northwest National Lab. (PNNL), Richland, WA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1044071
Patent Number(s):
8,166,777
Application Number:
12/729,096
Assignee:
Battelle Memorial Institute (Richland, WA)
DOE Contract Number:  
AC05-76RL01830
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Meinhardt, Kerry D, and Kirby, Brent W. Glass composition and process for sealing void spaces in electrochemical devices. United States: N. p., 2012. Web.
Meinhardt, Kerry D, & Kirby, Brent W. Glass composition and process for sealing void spaces in electrochemical devices. United States.
Meinhardt, Kerry D, and Kirby, Brent W. Tue . "Glass composition and process for sealing void spaces in electrochemical devices". United States. https://www.osti.gov/servlets/purl/1044071.
@article{osti_1044071,
title = {Glass composition and process for sealing void spaces in electrochemical devices},
author = {Meinhardt, Kerry D and Kirby, Brent W},
abstractNote = {A glass foaming material and method are disclosed for filling void spaces in electrochemical devices. The glass material includes a reagent that foams at a temperature above the softening point of the glass. Expansion of the glass fills void spaces including by-pass and tolerance channels of electrochemical devices. In addition, cassette to cassette seals can also be formed while channels and other void spaces are filled, reducing the number of processing steps needed.},
doi = {},
url = {https://www.osti.gov/biblio/1044071}, journal = {},
number = ,
volume = ,
place = {United States},
year = {2012},
month = {5}
}

Patent:

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