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Title: Method of electroplating a conversion electron emitting source on implant

Abstract

Methods for preparing an implant coated with a conversion electron emitting source (CEES) are disclosed. The typical method includes cleaning the surface of the implant; placing the implant in an activating solution comprising hydrochloric acid to activate the surface; reducing the surface by H.sub.2 evolution in H.sub.2SO.sub.4 solution; and placing the implant in an electroplating solution that includes ions of the CEES, HCl, H.sub.2SO.sub.4, and resorcinol, gelatin, or a combination thereof. Alternatively, before tin plating, a seed layer is formed on the surface. The electroplated CEES coating can be further protected and stabilized by annealing in a heated oven, by passivation, or by being covered with a protective film. The invention also relates to a holding device for holding an implant, wherein the device selectively prevents electrodeposition on the portions of the implant contacting the device.

Inventors:
 [1];  [2];  [3];  [4]
  1. Setauket, NY
  2. New York, NY
  3. East Setauket, NY
  4. Middle Island, NY
Publication Date:
Research Org.:
Brookhaven National Lab. (BNL), Upton, NY (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1036999
Patent Number(s):
8,114,264
Application Number:
11/758,914
Assignee:
Brookhaven Science Associates (Upton, NY)
DOE Contract Number:  
AC02-98CH10886
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY

Citation Formats

Srivastava, Suresh C, Gonzales, Gilbert R, Adzic, Radoslav, and Meinken, George E. Method of electroplating a conversion electron emitting source on implant. United States: N. p., 2012. Web.
Srivastava, Suresh C, Gonzales, Gilbert R, Adzic, Radoslav, & Meinken, George E. Method of electroplating a conversion electron emitting source on implant. United States.
Srivastava, Suresh C, Gonzales, Gilbert R, Adzic, Radoslav, and Meinken, George E. Tue . "Method of electroplating a conversion electron emitting source on implant". United States. https://www.osti.gov/servlets/purl/1036999.
@article{osti_1036999,
title = {Method of electroplating a conversion electron emitting source on implant},
author = {Srivastava, Suresh C and Gonzales, Gilbert R and Adzic, Radoslav and Meinken, George E},
abstractNote = {Methods for preparing an implant coated with a conversion electron emitting source (CEES) are disclosed. The typical method includes cleaning the surface of the implant; placing the implant in an activating solution comprising hydrochloric acid to activate the surface; reducing the surface by H.sub.2 evolution in H.sub.2SO.sub.4 solution; and placing the implant in an electroplating solution that includes ions of the CEES, HCl, H.sub.2SO.sub.4, and resorcinol, gelatin, or a combination thereof. Alternatively, before tin plating, a seed layer is formed on the surface. The electroplated CEES coating can be further protected and stabilized by annealing in a heated oven, by passivation, or by being covered with a protective film. The invention also relates to a holding device for holding an implant, wherein the device selectively prevents electrodeposition on the portions of the implant contacting the device.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2012},
month = {2}
}

Patent:

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