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Title: Characteristics of Creep Damage for 60Sn-40Pb Solder Material

Abstract

This paper presents a viscoplasticity model taking into account the effects of change in grain or phase size and damage on the characterization of creep damage in 60Sn-40Pb solder. Based on the theory of damage mechanics, a two-scalar damage model is developed for isotropic materials by introducing the free energy equivalence principle. The damage evolution equations are derived in terms of the damage energy release rates. In addition, a failure criterion is developed based on the postulation that a material element is said to have ruptured when the total damage accumulated in the element reaches a critical value. The damage coupled viscoplasticity model is discretized and coded in a general-purpose finite element program known as ABAQUS through its user-defined material subroutine UMAT. To illustrate the application of the model, several example cases are introduced to analyze, both numerically and experimentally, the tensile creep behaviors of the material at three stress levels. The model is then applied to predict the deformation of a notched specimen under monotonic tension at room temperature (22 C). The results demonstrate that the proposed model can successfully predict the viscoplastic behavior of the solder material.

Authors:
; ; ;
Publication Date:
Research Org.:
Sandia National Labs., Albuquerque, NM (US); Sandia National Labs., Livermore, CA (US)
Sponsoring Org.:
US Department of Energy (US)
OSTI Identifier:
10363
Report Number(s):
SAND99-2204C
TRN: AH200125%%376
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Conference
Resource Relation:
Conference: 1999 International Mechanical Engineering Congress and Exposition (IMECE'99), Nashville, TN (US), 11/14/1999--11/19/1999; Other Information: PBD: 26 Aug 1999
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; CREEP; DEFORMATION; EQUIVALENCE PRINCIPLE; FREE ENERGY; SOLDERING

Citation Formats

Wei, Y., Chow, C.L., Fang, H.E., and Neilsen, M.K. Characteristics of Creep Damage for 60Sn-40Pb Solder Material. United States: N. p., 1999. Web.
Wei, Y., Chow, C.L., Fang, H.E., & Neilsen, M.K. Characteristics of Creep Damage for 60Sn-40Pb Solder Material. United States.
Wei, Y., Chow, C.L., Fang, H.E., and Neilsen, M.K. Thu . "Characteristics of Creep Damage for 60Sn-40Pb Solder Material". United States. https://www.osti.gov/servlets/purl/10363.
@article{osti_10363,
title = {Characteristics of Creep Damage for 60Sn-40Pb Solder Material},
author = {Wei, Y. and Chow, C.L. and Fang, H.E. and Neilsen, M.K.},
abstractNote = {This paper presents a viscoplasticity model taking into account the effects of change in grain or phase size and damage on the characterization of creep damage in 60Sn-40Pb solder. Based on the theory of damage mechanics, a two-scalar damage model is developed for isotropic materials by introducing the free energy equivalence principle. The damage evolution equations are derived in terms of the damage energy release rates. In addition, a failure criterion is developed based on the postulation that a material element is said to have ruptured when the total damage accumulated in the element reaches a critical value. The damage coupled viscoplasticity model is discretized and coded in a general-purpose finite element program known as ABAQUS through its user-defined material subroutine UMAT. To illustrate the application of the model, several example cases are introduced to analyze, both numerically and experimentally, the tensile creep behaviors of the material at three stress levels. The model is then applied to predict the deformation of a notched specimen under monotonic tension at room temperature (22 C). The results demonstrate that the proposed model can successfully predict the viscoplastic behavior of the solder material.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {8}
}

Conference:
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