Thermomechanical Reliability Investigation of Large Temperature Excursions in Power Electronics Packages
Conference
·
OSTI ID:1031008
- ORNL
- Virginia Polytechnic Institute and State University (Virginia Tech)
This study confirms that high stresses between the metallization layer and ceramic lead to significant failures in DBC substrate. The driving forces behind several different failure modes are discussed. Further understanding of these failure mechanisms enables the modules to be engineered for longtime operation and helps to enhance the reliability of system-level operation.
- Research Organization:
- Oak Ridge National Lab. (ORNL), Oak Ridge, TN (United States). Power Electronics and Electric Machinery Research Facility
- Sponsoring Organization:
- USDOE Office of Energy Efficiency and Renewable Energy (EERE)
- DOE Contract Number:
- DE-AC05-00OR22725
- OSTI ID:
- 1031008
- Resource Relation:
- Conference: IEEE Energy Conversion Congress & Exposition (ECCE 2011), Phoenix, AZ, USA, 20110917, 20110922
- Country of Publication:
- United States
- Language:
- English
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