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Title: Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom

Abstract

An electrically and ionically conductive porous material including a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material. The thermoplastic binder immobilizes the moieties with respect to each other but does not substantially coat the moieties and forms the electrically conductive porous material. A wafer of the material and a method of making the material and wafer are disclosed.

Inventors:
 [1];  [2];  [3]
  1. Naperville, IL
  2. Batavia, IL
  3. Lincolnwood, IL
Publication Date:
Research Org.:
Argonne National Lab. (ANL), Argonne, IL (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1019427
Patent Number(s):
7,977,395
Application Number:
US Patent Application 12/288,554
Assignee:
UChicago Argonne, LLC (Chicago, IL) CHO
DOE Contract Number:  
W-31-109-ENG-38
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE

Citation Formats

Lin, YuPo J, Henry, Michael P, and Snyder, Seth W. Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom. United States: N. p., 2011. Web.
Lin, YuPo J, Henry, Michael P, & Snyder, Seth W. Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom. United States.
Lin, YuPo J, Henry, Michael P, and Snyder, Seth W. Tue . "Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom". United States. https://www.osti.gov/servlets/purl/1019427.
@article{osti_1019427,
title = {Electronically and ionically conductive porous material and method for manufacture of resin wafers therefrom},
author = {Lin, YuPo J and Henry, Michael P and Snyder, Seth W},
abstractNote = {An electrically and ionically conductive porous material including a thermoplastic binder and one or more of anion exchange moieties or cation exchange moieties or mixtures thereof and/or one or more of a protein capture resin and an electrically conductive material. The thermoplastic binder immobilizes the moieties with respect to each other but does not substantially coat the moieties and forms the electrically conductive porous material. A wafer of the material and a method of making the material and wafer are disclosed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2011},
month = {7}
}

Patent:

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