A method for the thermal characterization, visualization, and integrity evaluation of conducting material samples or complex structures
This invention is useful in thermal imaging of conducting materials, and is particularly useful in measuring thermal conductivity and thermal boundary conditions in composite anisotropic materials, in materials of irregular shape, and in materials for high-temperature applications. It also has utility in visualizing the integrity of complex structures such as a machine, power plant, or chemical plant. The method is for modeling a conducting material sample or structure (system) as an electrical network of resistances, for measuring electric resistance between selected leads attached to the surface of the system, and, using basic circuit theory, for translating measured resistances into temperatures or indications of integrity in corresponding regions of the system. 10 figs.
- Research Organization:
- EG and G Idaho, Inc., Idaho Falls, ID (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC07-76ID01570
- Assignee:
- Dept. of Energy
- Patent Number(s):
- PATENTS-US-A7739376
- Application Number:
- ON: DE93019338; PAN: 7-739,376
- OSTI ID:
- 10179730
- Resource Relation:
- Other Information: PBD: 1991
- Country of Publication:
- United States
- Language:
- English
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