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Title: Silicon MCM substrates for integration of III-V photonic devices and CMOS IC`s

Abstract

The progress made in advanced packaging development at Sandia National Laboratories for integration of III-V photonic devices and CMOS IC`s on Silicon MCM substrates for planar aid stacked applications will be reported. Studies to characterize precision alignment techniques using solder attach materials compatible with both silicon IC`s and III-V devices will be discussed. Examples of the use of back-side alignment and IR through-wafer inspection will be shown along with the extra processing steps that are used. Under bump metallurgy considerations are also addressed.

Authors:
; ; ;
Publication Date:
Research Org.:
Sandia National Labs., Albuquerque, NM (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
10178354
Report Number(s):
SAND-93-1773C; CONF-9307112-1-Vugraphs
ON: DE93017894
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Conference
Resource Relation:
Conference: International workshop on optoelectronic packaging science,Santa Barbara, CA (United States),28 Jul 1993; Other Information: PBD: [1993]
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; INTEGRATED CIRCUITS; PACKAGING; MOS TRANSISTORS; ALIGNMENT; SUBSTRATES; 426000; COMPONENTS, ELECTRON DEVICES AND CIRCUITS

Citation Formats

Seigal, P, Carson, R, Flores, R, and Rose, B. Silicon MCM substrates for integration of III-V photonic devices and CMOS IC`s. United States: N. p., 1993. Web.
Seigal, P, Carson, R, Flores, R, & Rose, B. Silicon MCM substrates for integration of III-V photonic devices and CMOS IC`s. United States.
Seigal, P, Carson, R, Flores, R, and Rose, B. 1993. "Silicon MCM substrates for integration of III-V photonic devices and CMOS IC`s". United States. https://www.osti.gov/servlets/purl/10178354.
@article{osti_10178354,
title = {Silicon MCM substrates for integration of III-V photonic devices and CMOS IC`s},
author = {Seigal, P and Carson, R and Flores, R and Rose, B},
abstractNote = {The progress made in advanced packaging development at Sandia National Laboratories for integration of III-V photonic devices and CMOS IC`s on Silicon MCM substrates for planar aid stacked applications will be reported. Studies to characterize precision alignment techniques using solder attach materials compatible with both silicon IC`s and III-V devices will be discussed. Examples of the use of back-side alignment and IR through-wafer inspection will be shown along with the extra processing steps that are used. Under bump metallurgy considerations are also addressed.},
doi = {},
url = {https://www.osti.gov/biblio/10178354}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Thu Jul 01 00:00:00 EDT 1993},
month = {Thu Jul 01 00:00:00 EDT 1993}
}

Conference:
Other availability
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