skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Aerogels for microelectronic applications: Fast, inexpensive, and light as air

Abstract

Silica aerogel consists of bonded silicon and oxygen joined into log strands, which are randomly linked together with pockets of air between them. Discovered in the 1930s, the material was thought to have little use outside of theoretical science. However, with the advent of greatly improved processing techniques, such as those developed at Lawrence Livermore National Laboratory, aerogels are on the verge of commercialization. This document describes the need for aerogels in the high-speed microelectronics industry, and state of the art processing techniques. Collaboration is welcomed in the endeavor.

Authors:
; ;
Publication Date:
Research Org.:
Lawrence Livermore National Lab., CA (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
10175075
Report Number(s):
UCRL-JC-113650; CONF-9303198-3
ON: DE93017170
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Conference
Resource Relation:
Conference: National Center for Advanced Information Components Manufacturing (NCAICM) workshop,Albuquerque, NM (United States),30-31 Mar 1993; Other Information: PBD: 25 Mar 1993
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 36 MATERIALS SCIENCE; MICROELECTRONIC CIRCUITS; DIELECTRIC MATERIALS; GELS; COMMERCIALIZATION; SILICA; DIELECTRIC PROPERTIES; GELATION; TECHNOLOGY TRANSFER; WEIGHT; 426000; 360601; COMPONENTS, ELECTRON DEVICES AND CIRCUITS; PREPARATION AND MANUFACTURE

Citation Formats

Contolini, R.J., Hrubesh, L.W., and Bernhardt, A.F. Aerogels for microelectronic applications: Fast, inexpensive, and light as air. United States: N. p., 1993. Web.
Contolini, R.J., Hrubesh, L.W., & Bernhardt, A.F. Aerogels for microelectronic applications: Fast, inexpensive, and light as air. United States.
Contolini, R.J., Hrubesh, L.W., and Bernhardt, A.F. Thu . "Aerogels for microelectronic applications: Fast, inexpensive, and light as air". United States. doi:. https://www.osti.gov/servlets/purl/10175075.
@article{osti_10175075,
title = {Aerogels for microelectronic applications: Fast, inexpensive, and light as air},
author = {Contolini, R.J. and Hrubesh, L.W. and Bernhardt, A.F.},
abstractNote = {Silica aerogel consists of bonded silicon and oxygen joined into log strands, which are randomly linked together with pockets of air between them. Discovered in the 1930s, the material was thought to have little use outside of theoretical science. However, with the advent of greatly improved processing techniques, such as those developed at Lawrence Livermore National Laboratory, aerogels are on the verge of commercialization. This document describes the need for aerogels in the high-speed microelectronics industry, and state of the art processing techniques. Collaboration is welcomed in the endeavor.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Thu Mar 25 00:00:00 EST 1993},
month = {Thu Mar 25 00:00:00 EST 1993}
}

Conference:
Other availability
Please see Document Availability for additional information on obtaining the full-text document. Library patrons may search WorldCat to identify libraries that hold this conference proceeding.

Save / Share: