Aerogels for microelectronic applications: Fast, inexpensive, and light as air
Conference
·
OSTI ID:10175075
Silica aerogel consists of bonded silicon and oxygen joined into log strands, which are randomly linked together with pockets of air between them. Discovered in the 1930s, the material was thought to have little use outside of theoretical science. However, with the advent of greatly improved processing techniques, such as those developed at Lawrence Livermore National Laboratory, aerogels are on the verge of commercialization. This document describes the need for aerogels in the high-speed microelectronics industry, and state of the art processing techniques. Collaboration is welcomed in the endeavor.
- Research Organization:
- Lawrence Livermore National Lab., CA (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- W-7405-ENG-48
- OSTI ID:
- 10175075
- Report Number(s):
- UCRL-JC-113650; CONF-9303198-3; ON: DE93017170
- Resource Relation:
- Conference: National Center for Advanced Information Components Manufacturing (NCAICM) workshop,Albuquerque, NM (United States),30-31 Mar 1993; Other Information: PBD: 25 Mar 1993
- Country of Publication:
- United States
- Language:
- English
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