Aerogels for microelectronic applications: Fast, inexpensive, and light as air

Contolini, R J; Hrubesh, L W; Bernhardt, A F

Title: Aerogels for microelectronic applications: Fast, inexpensive, and light as air

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Abstract

Silica aerogel consists of bonded silicon and oxygen joined into log strands, which are randomly linked together with pockets of air between them. Discovered in the 1930s, the material was thought to have little use outside of theoretical science. However, with the advent of greatly improved processing techniques, such as those developed at Lawrence Livermore National Laboratory, aerogels are on the verge of commercialization. This document describes the need for aerogels in the high-speed microelectronics industry, and state of the art processing techniques. Collaboration is welcomed in the endeavor.

Authors:: Contolini, R J; Hrubesh, L W; Bernhardt, A F

Publication Date:: 1993-03-25

Research Org.:: Lawrence Livermore National Lab., CA (United States)

Sponsoring Org.:: USDOE, Washington, DC (United States)

OSTI Identifier:: 10175075

Report Number(s):: UCRL-JC-113650; CONF-9303198-3
ON: DE93017170

DOE Contract Number:: W-7405-ENG-48

Resource Type:: Conference

Resource Relation:: Conference: National Center for Advanced Information Components Manufacturing (NCAICM) workshop,Albuquerque, NM (United States),30-31 Mar 1993; Other Information: PBD: 25 Mar 1993

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING; 36 MATERIALS SCIENCE; MICROELECTRONIC CIRCUITS; DIELECTRIC MATERIALS; GELS; COMMERCIALIZATION; SILICA; DIELECTRIC PROPERTIES; GELATION; TECHNOLOGY TRANSFER; WEIGHT; 426000; 360601; COMPONENTS, ELECTRON DEVICES AND CIRCUITS; PREPARATION AND MANUFACTURE

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                    Contolini, R J, Hrubesh, L W, and Bernhardt, A F. Aerogels for microelectronic applications: Fast, inexpensive, and light as air.  United States: N. p., 1993. 
        Web.

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                    Contolini, R J, Hrubesh, L W, & Bernhardt, A F. Aerogels for microelectronic applications: Fast, inexpensive, and light as air.  United States.

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                    Contolini, R J, Hrubesh, L W, and Bernhardt, A F. 1993.  
        "Aerogels for microelectronic applications: Fast, inexpensive, and light as air".  United States.  https://www.osti.gov/servlets/purl/10175075.

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@article{osti_10175075,

  title        = {Aerogels for microelectronic applications: Fast, inexpensive, and light as air},

  author       = {Contolini, R J and Hrubesh, L W and Bernhardt, A F},

  abstractNote = {Silica aerogel consists of bonded silicon and oxygen joined into log strands, which are randomly linked together with pockets of air between them. Discovered in the 1930s, the material was thought to have little use outside of theoretical science. However, with the advent of greatly improved processing techniques, such as those developed at Lawrence Livermore National Laboratory, aerogels are on the verge of commercialization. This document describes the need for aerogels in the high-speed microelectronics industry, and state of the art processing techniques. Collaboration is welcomed in the endeavor.},

  doi          = {},

  url          = {https://www.osti.gov/biblio/10175075},
  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1993},

  month        = {3}

}

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