Nanometer-scale ablation using focused, coherent extreme ultraviolet/soft x-ray light
Patent
·
OSTI ID:1016677
- Fort Collins, CO
- San Diego, CA
- Encinitas, CA
- El Cerrito, CA
- Stockholm, SE
Ablation of holes having diameters as small as 82 nm and having clean walls was obtained in a poly(methyl methacrylate) on a silicon substrate by focusing pulses from a Ne-like Ar, 46.9 nm wavelength, capillary-discharge laser using a freestanding Fresnel zone plate diffracting into third order is described. Spectroscopic analysis of light from the ablation has also been performed. These results demonstrate the use of focused coherent EUV/SXR light for the direct nanoscale patterning of materials.
- Research Organization:
- Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC02-05CH11231
- Assignee:
- Colorado State University Research Foundation (Fort Collins, CO); The Regents of University of California (Oakland, CA); JMAR Technologies, Inc. (San Diego, CA)
- Patent Number(s):
- 7,931,850
- Application Number:
- US Patent Application 12/861,627
- OSTI ID:
- 1016677
- Country of Publication:
- United States
- Language:
- English
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