Method for double-sided processing of thin film transistors

Yuan, Hao-Chih; Wang, Guogong; Eriksson, Mark A; Evans, Paul G; Lagally, Max G; Ma, Zhenqiang

Title: Method for double-sided processing of thin film transistors

Patent · Tue Apr 08 00:00:00 EDT 2008

OSTI ID:1014530

Yuan, Hao-Chih ^[1]; Wang, Guogong ^[1]; Eriksson, Mark A ^[1]; Evans, Paul G ^[1]; Lagally, Max G ^[1]; Ma, Zhenqiang ^[2]

Madison, WI
Middleton, WI

This invention provides methods for fabricating thin film electronic devices with both front- and backside processing capabilities. Using these methods, high temperature processing steps may be carried out during both frontside and backside processing. The methods are well-suited for fabricating back-gate and double-gate field effect transistors, double-sided bipolar transistors and 3D integrated circuits.

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Research Organization:: Wisconsin Alumi Research Foundation (Madison, WI)

Sponsoring Organization:: USDOE

DOE Contract Number:: FG02-03ER46028

Assignee:: Wisconsin Alumi Research Foundation (Madison, WI)

Patent Number(s):: 7,354,809

Application Number:: 11/276,065

OSTI ID:: 1014530

Country of Publication:: United States

Language:: English

References (8)

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Bendable GaAs metal-semiconductor field-effect transistors formed with printed GaAs wire arrays on plastic substrates Sun, Yugang; Kim, Seiyon; Adesida, Ilesanmi Applied Physics Letters, Vol. 87, Issue 8, Article No. 083501 https://doi.org/10.1063/1.2032609	journal	August 2005
Silicon-based nanomembrane materials: the ultimate in strain engineering Yuan, Hao-Chih; Roberts, M. M.; Zhang, Pengpeng Digest of Papers. 2005 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 2005. https://doi.org/10.1109/SMIC.2005.1587986	conference	January 2006
Spin on dopants for high-performance single-crystal silicon transistors on flexible plastic substrates Zhu, Z.-T.; Menard, E.; Hurley, K. Applied Physics Letters, Vol. 86, Issue 13, Article No. 133507 https://doi.org/10.1063/1.1894611	journal	March 2005
Three-dimensional integration: technology, use, and issues for mixed-signal applications Xue, Lei; Liu, C. C.; Kim, Hong-Seung IEEE Transactions on Electron Devices, Vol. 50, Issue 3, p. 601-609 https://doi.org/10.1109/TED.2003.810465	journal	March 2003
Three-Dimensional Nanofabrication with Rubber Stamps and Conformable Photomasks Jeon, S.; Menard, E.; Park, J.-U. Advanced Materials, Vol. 16, Issue 15, p. 1369-1373 https://doi.org/10.1002/adma.200400593	journal	August 2004
Bendable single crystal silicon thin film transistors formed by printing on plastic substrates Menard, E.; Nuzzo, R. G.; Rogers, J. A. Applied Physics Letters, Vol. 86, Issue 9, Article No. 093507 https://doi.org/10.1063/1.1866637	journal	February 2005
A printable form of silicon for high performance thin film transistors on plastic substrates Menard, E.; Lee, K. J.; Khang, D.-Y. Applied Physics Letters, Vol. 84, Issue 26, p. 5398-5400 https://doi.org/10.1063/1.1767591	journal	June 2004

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