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Title: Thick film fabrication of aluminum nitride microcircuits. Final report

Abstract

A new substrate material, aluminum nitride (AlN), and 11 new thick film inks were analyzed to determine their chemical compatibility, their electrical properties, their mechanical properties, and their overall suitability for use in the manufacturing of high-power microcircuits with efficient thermal properties. Because high-power chips emit a great deal of heat in a small surface area, a new substrate material was needed to dissipate that heat faster than the substrate material currently in use. Overall, the new materials were found to be acceptable for accomplishing this purpose.

Authors:
Publication Date:
Research Org.:
Allied-Signal Aerospace Co., Kansas City, MO (United States). Kansas City Div.
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
10143124
Report Number(s):
KCP-613-5283
ON: DE94010107; TRN: AHC29409%%78
DOE Contract Number:  
AC04-76DP00613
Resource Type:
Technical Report
Resource Relation:
Other Information: PBD: Mar 1994
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 36 MATERIALS SCIENCE; ALUMINIUM NITRIDES; RESEARCH PROGRAMS; MICROELECTRONIC CIRCUITS; FABRICATION; PROGRESS REPORT; ALUMINIUM OXIDES; PERFORMANCE; THERMAL CONDUCTIVITY; THERMAL EXPANSION; TECHNOLOGY TRANSFER; INKS; 426000; 360200; COMPONENTS, ELECTRON DEVICES AND CIRCUITS; CERAMICS, CERMETS, AND REFRACTORIES

Citation Formats

Perdieu, L.H. Thick film fabrication of aluminum nitride microcircuits. Final report. United States: N. p., 1994. Web. doi:10.2172/10143124.
Perdieu, L.H. Thick film fabrication of aluminum nitride microcircuits. Final report. United States. doi:10.2172/10143124.
Perdieu, L.H. Tue . "Thick film fabrication of aluminum nitride microcircuits. Final report". United States. doi:10.2172/10143124. https://www.osti.gov/servlets/purl/10143124.
@article{osti_10143124,
title = {Thick film fabrication of aluminum nitride microcircuits. Final report},
author = {Perdieu, L.H.},
abstractNote = {A new substrate material, aluminum nitride (AlN), and 11 new thick film inks were analyzed to determine their chemical compatibility, their electrical properties, their mechanical properties, and their overall suitability for use in the manufacturing of high-power microcircuits with efficient thermal properties. Because high-power chips emit a great deal of heat in a small surface area, a new substrate material was needed to dissipate that heat faster than the substrate material currently in use. Overall, the new materials were found to be acceptable for accomplishing this purpose.},
doi = {10.2172/10143124},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1994},
month = {3}
}