The microchannel heatsink with liquid nitrogen cooling

Conference · Tue Jun 09 00:00:00 EDT 1992

OSTI ID:10142889

Riddle, R A; Bernhardt, A F

Excellent thermal performance of a silicon microchannel heatsink is demonstrated using liquid nitrogen as the coolant over a wide range of heat loads up to 1 kW/cm{sup 2}. This performance is partly due to the order of magnitude increase in the thermal conductivity of silicon near 77 {degree}K compared to room temperature. Subcooled boiling of the liquid nitrogen in the microchannel heatsink further enhances the thermal performance but makes the thermal resistance a nonlinear function of heat load. For a 500 W/cm{sup 2} heat load, a thermal resistances of 0.052 cm{sup 2*0}C/W for a 9:1 aspect ratio heatsink was measured.

• Research Organization: Lawrence Livermore National Lab., CA (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: W-7405-ENG-48
• OSTI ID: 10142889
• Report Number(s): UCRL-JC-109267; CONF-920792-49; ON: DE93009258
• Resource Relation: Conference: 37. annual Society of Photo-Optical Instrumentation Engineers (SPIE) international symposium on optical and optoelectronic applied science and engineering,San Diego, CA (United States),19-24 Jul 1992; Other Information: PBD: 9 Jun 1992
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
HEAT SINKS
COOLING
LIQUEFIED GASES
NITROGEN
COOLANTS
THERMAL ANALYSIS
ELECTRONIC EQUIPMENT
SUBCOOLED BOILING
426000
COMPONENTS
ELECTRON DEVICES AND CIRCUITS