Diamond: A new high thermal conductivity substrate for multichip modules and hybrid circuits
Abstract
As applications for hybrid circuits and multichip modules create demand for higher density circuits and higher power components, new substrate materials are required to deal with the heat generated on the circuit. Sandia National Laboratories is developing diamond substrate technology to meet the requirements of high thermal conductivity. Thin film processes were developed and characterized to delineate conductor-resistor networks on free standing diamond substrates having fine line gold conductors and low and high sheet resistivity resistors. Thin film hybrid circuit technology was developed on CVD-processed, polycrystalline diamond substrates having as-deposited surface finishes as well as those with polished surfaces. Conductors were defined by pattern plating gold and resistors were processed from sputtered tantalum nitride films which were deposited to sheet resistivities of 5 and/or 100 ohms per square. Resistor films on diamond substrates were evaluated for Temperature Coefficient of Resistance (TCR), stability with time and temperature, and trimmability using YAG laser processing. Plated gold conductors were patterned on diamond to feature sizes of 25 microns and successfully tested for adhesion and bondability. Advanced YAG laser trimming techniques were developed to allow resistor trims on both low and high value resistors to within 1% of desip value while maintaining required resistormore »
- Authors:
- Publication Date:
- Research Org.:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE, Washington, DC (United States)
- OSTI Identifier:
- 10134836
- Report Number(s):
- SAND-92-2476C; CONF-9306104-2
ON: DE93008337
- DOE Contract Number:
- AC04-76DP00789
- Resource Type:
- Conference
- Resource Relation:
- Conference: 43. electronic component and technology conference,Orlando, FL (United States),1-3 Jun 1993; Other Information: PBD: [1992]
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 42 ENGINEERING; 75 CONDENSED MATTER PHYSICS, SUPERCONDUCTIVITY AND SUPERFLUIDITY; DIAMONDS; CHEMICAL VAPOR DEPOSITION; INTEGRATED CIRCUITS; THERMAL CONDUCTIVITY; SUBSTRATES; LASERS; THIN FILMS; MICROELECTRONICS; 426000; 665300; COMPONENTS, ELECTRON DEVICES AND CIRCUITS; INTERACTIONS BETWEEN BEAMS AND CONDENSED MATTER
Citation Formats
Norwood, D, Worobey, W, Peterson, D, and Miller, D. Diamond: A new high thermal conductivity substrate for multichip modules and hybrid circuits. United States: N. p., 1992.
Web.
Norwood, D, Worobey, W, Peterson, D, & Miller, D. Diamond: A new high thermal conductivity substrate for multichip modules and hybrid circuits. United States.
Norwood, D, Worobey, W, Peterson, D, and Miller, D. 1992.
"Diamond: A new high thermal conductivity substrate for multichip modules and hybrid circuits". United States.
@article{osti_10134836,
title = {Diamond: A new high thermal conductivity substrate for multichip modules and hybrid circuits},
author = {Norwood, D and Worobey, W and Peterson, D and Miller, D},
abstractNote = {As applications for hybrid circuits and multichip modules create demand for higher density circuits and higher power components, new substrate materials are required to deal with the heat generated on the circuit. Sandia National Laboratories is developing diamond substrate technology to meet the requirements of high thermal conductivity. Thin film processes were developed and characterized to delineate conductor-resistor networks on free standing diamond substrates having fine line gold conductors and low and high sheet resistivity resistors. Thin film hybrid circuit technology was developed on CVD-processed, polycrystalline diamond substrates having as-deposited surface finishes as well as those with polished surfaces. Conductors were defined by pattern plating gold and resistors were processed from sputtered tantalum nitride films which were deposited to sheet resistivities of 5 and/or 100 ohms per square. Resistor films on diamond substrates were evaluated for Temperature Coefficient of Resistance (TCR), stability with time and temperature, and trimmability using YAG laser processing. Plated gold conductors were patterned on diamond to feature sizes of 25 microns and successfully tested for adhesion and bondability. Advanced YAG laser trimming techniques were developed to allow resistor trims on both low and high value resistors to within 1% of desip value while maintaining required resistor stability, new trim techniques were needed to offset the carbonization of diamond in the laser trim area. Reliability studies were carried out on the diamond thin film networks which showed them to compare favorably with the same thin film technology on alumina substrates.},
doi = {},
url = {https://www.osti.gov/biblio/10134836},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Thu Dec 31 00:00:00 EST 1992},
month = {Thu Dec 31 00:00:00 EST 1992}
}