An electrical test system for conductor formation process analysis
- Sandia National Labs., Albuquerque, NM (United States)
- AT and T Bell Labs., Whippany, NJ (United States)
Sandia National Laboratories has designed and built an electrical test system which fulfills a requirement to quickly, accurately and precisely measure the resistance of conductors formed on Printed Wiring Board (PWB) substrates. This requirement stems from the need to measure small variations in conductors and thus to determine the source of the variations. With this test technology, experiments can be conducted with new materials, equipment, and processes in a timely and scientific manner. Conductor formation processes can be optimized for both conductor yield and uniformity, and process equipment can be fine-tuned prior to processing product to ensure that conductor attributes fulfill requirements. Significant resources have been spent by Sandia National Laboratories and Texas Instruments modifying commercially available two-probe testers. AT&T has built a two-probe tester and obtained a commercially available ``bed-of-nails`` test system. The two-probe systems have limitations in speed and precision; the ``bed-of-nails`` system has proved to be superior to the two-probe designs but is expensive, and lacks test pattern flexibility and ease of use. Due to the need to establish a testing technology which meets the requirements of Sandia National Laboratories and the National Center for Manufacturing Sciences PWB Consortium Imaging Team (current Imaging Team members; AT&T, Texas Instruments, AlliedSignal, IBM, and Sandia National Laboratories), a prototype test system was designed and built by Sandia. This paper will discuss the design and performance of the test system and the results of a comparison to other test systems.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 10128109
- Report Number(s):
- SAND-94-0597C; CONF-9404112-1; ON: DE94007291; BR: GB0103012
- Resource Relation:
- Conference: Institute for Interconnecting and Packaging Electronic Circuits (IPC) printed circuits spring expo,Boston, MA (United States),24-27 Apr 1994; Other Information: PBD: [1994]
- Country of Publication:
- United States
- Language:
- English
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