Technologies 2

Multimedia · Mon Mar 14 00:00:00 EDT 2011

OSTI ID:1012145

Henry, David

Advanced Packaging in Leti. Topics include wafter level packaging, key processes & technologies, applications examples, 3D integration, key processes & technologies, and applications examples.

• OSTI ID: 1012145
• Country of Publication: CERN
• Language: English

Related Subjects

36 MATERIALS SCIENCE
LETI
CEA
ATOMS
PACKAGING
BONDING
3D INTEGRATION