Evaluation of tensile static, dynamic, and cyclic fatigue behavior for a HIPed silicon nitride at elevated temperatures
- Oak Ridge Inst. for Science and Education, TN (United States)
- Oak Ridge National Lab., TN (United States)
Tensile fatigue behavior of a hot-isostatically-pressed (HIPed) silicon nitride was investigated over ranges of constant stresses, constant stressing rates, and cyclic loading at 1150--1370{degrees}C. At 1150{degrees}C, static and dynamic fatigue failures were governed by slow crack growth mechanism. Creep rupture was the dominant failure mechanism in static fatigue at 1260 and 1370{degrees}C. A transition of failure mechanism from slow crack growth to creep rupture appeared at stressing rates {le}10{sup {minus}2} MPa/s for dynamic fatigue at 1260 and 1370{degrees}C. At 1150--1370{degrees}C, cyclic loading appeared to be less damaging than static loading as cyclic fatigue specimens last longer than static fatigue specimens under the same maximum stresses.
- Research Organization:
- Oak Ridge National Lab., TN (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC05-84OR21400
- OSTI ID:
- 10116306
- Report Number(s):
- CONF-921101-27; ON: DE93005149
- Resource Relation:
- Conference: 16. Materials Research Society (MRS) fall meeting,Boston, MA (United States),30 Nov - 5 Dec 1992; Other Information: PBD: [1992]
- Country of Publication:
- United States
- Language:
- English
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