Microstructural development and mechanical behavior of eutectic bismuth-tin and eutectic indium-tin in response to high temperature deformation
- Univ. of California, Berkeley, CA (United States). Dept. of Materials Science and Mineral Engineering
The mechanical behavior and microstructure of eutectic Bi-Sn and In-Sn solders were studied in parallel in order to better understand high temperature deformation of these alloys. Bi-Sn solder joints were made with Cu substrates, and In-Sn joints were made with either Cu or Ni substrates. The as-cast microstructure of Bi-Sn is complex regular, with the two eutectic phases interconnected in complicated patterns. The as-cast microstructure of In-Sn depends on the substrate. In-Sn on Cu has a non-uniform microstructure caused by diffusion of Cu into the solder during sample preparation, with regions of the Sn-rich γ phase imbedded in a matrix of the In-rich β phase. The microstructure of In-Sn on Ni is uniform and lamellar and the two phases are strongly coupled. The solders deform non-uniformly, with deformation concentrating in a band along the length of the sample for Bi-Sn and In-Sn on Cu, though the deformation is more diffuse in In-Sn than in Bi-Sn. Deformation of In-Sn on Ni spreads throughout the width of the joint. The different deformation patterns affect the shape of the stress-strain curves. Stress-strain curves for Bi-Sn and In-Sn on Cu exhibit sharp decays in the engineering stress after reaching a peak. Most of this stress decay is removed for In-Sn on Ni. The creep behavior of In-Sn also depends on the substrate, with the creep deformation controlled by the soft P phase of the eutectic for In-Sn on Cu and controlled by the harder γ phase for In-Sn on Ni. When In-Sn on Ni samples are aged, the microstructure coarsens and changes to an array of γ phase regions in a matrix of the β phase, and the creep behavior changes to resemble that of In-Sn on Cu. The creep behavior of Bi-Sn changes with temperature. Two independent mechanisms operate at lower temperatures, but there is still some question as to whether one or both of these, or a third mechanism, operates at higher temperatures.
- Research Organization:
- Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC03-76SF00098
- OSTI ID:
- 10115053
- Report Number(s):
- LBL-34909; ON: DE94005202; TRN: 94:001217
- Resource Relation:
- Other Information: TH: Thesis (Ph.D.); PBD: Nov 1993
- Country of Publication:
- United States
- Language:
- English
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