Processing a printed wiring board by single bath electrodeposition
Patent
·
OSTI ID:1011445
- Oakland, CA
- Livermore, CA
A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.
- Research Organization:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- W-7405-ENG-48
- Assignee:
- Lawrence Livermore National Security, LLC (Livermore, CA)
- Patent Number(s):
- 7,846,317
- Application Number:
- 10/373,350
- OSTI ID:
- 1011445
- Country of Publication:
- United States
- Language:
- English
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