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Title: Interdiffusion and grain-boundary migration in Au-Cu bilayers during ion-irradiation

Abstract

Ion irradiation and annealing experiments have been conducted on Au/Cu bilayer films to evaluate the effect of irradiation on diffusion-induced grain boundary migration (DIGM). The Au films were prepared with a large-grained microstructure with grain boundaries perpendicular to the film surface and extending through the film thickness. Irradiations were conducted with 1.5 MeV Kr at 228{degree}C. Rutherford backscattering spectrometry of the samples revealed that interdiffusion was substantially enhanced in the irradiated area relative to the unirradiated area. Both irradiated and annealed-only areas were characterized by a nearly uniform composition of 14 at.% and 7 at.% Cu respectively through the entire thickness of the underlying Au film. Small probe X-ray energy dispersive spectroscopy showed significant lateral compositional homogeneities in both irradiated and annealed areas. These two results are consistent with previous observations of DIGM in the Au/Cu system, suggesting that this previously unexamined mechanism contributes to ion beam mixing.

Authors:
; ;
Publication Date:
Research Org.:
Argonne National Lab., IL (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
10110587
Report Number(s):
ANL/CP-73625; CONF-911202-19
ON: DE92005238
DOE Contract Number:  
W-31109-ENG-38
Resource Type:
Conference
Resource Relation:
Conference: Annual fall meeting of the Materials Research Society (MRS),Boston, MA (United States),2-6 Dec 1991; Other Information: PBD: Nov 1991
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; GOLD; PHYSICAL RADIATION EFFECTS; COPPER; INTERFACES; MIXING; GRAIN BOUNDARIES; LAYERS; KRYPTON IONS; MICROSTRUCTURE; 360101; 360106; 360102; PREPARATION AND FABRICATION; RADIATION EFFECTS; STRUCTURE AND PHASE STUDIES

Citation Formats

Alexander, D E, Rehn, L E, and Baldo, P M. Interdiffusion and grain-boundary migration in Au-Cu bilayers during ion-irradiation. United States: N. p., 1991. Web.
Alexander, D E, Rehn, L E, & Baldo, P M. Interdiffusion and grain-boundary migration in Au-Cu bilayers during ion-irradiation. United States.
Alexander, D E, Rehn, L E, and Baldo, P M. 1991. "Interdiffusion and grain-boundary migration in Au-Cu bilayers during ion-irradiation". United States. https://www.osti.gov/servlets/purl/10110587.
@article{osti_10110587,
title = {Interdiffusion and grain-boundary migration in Au-Cu bilayers during ion-irradiation},
author = {Alexander, D E and Rehn, L E and Baldo, P M},
abstractNote = {Ion irradiation and annealing experiments have been conducted on Au/Cu bilayer films to evaluate the effect of irradiation on diffusion-induced grain boundary migration (DIGM). The Au films were prepared with a large-grained microstructure with grain boundaries perpendicular to the film surface and extending through the film thickness. Irradiations were conducted with 1.5 MeV Kr at 228{degree}C. Rutherford backscattering spectrometry of the samples revealed that interdiffusion was substantially enhanced in the irradiated area relative to the unirradiated area. Both irradiated and annealed-only areas were characterized by a nearly uniform composition of 14 at.% and 7 at.% Cu respectively through the entire thickness of the underlying Au film. Small probe X-ray energy dispersive spectroscopy showed significant lateral compositional homogeneities in both irradiated and annealed areas. These two results are consistent with previous observations of DIGM in the Au/Cu system, suggesting that this previously unexamined mechanism contributes to ion beam mixing.},
doi = {},
url = {https://www.osti.gov/biblio/10110587}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Fri Nov 01 00:00:00 EST 1991},
month = {Fri Nov 01 00:00:00 EST 1991}
}

Conference:
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