Thermal and Electromigration-Induced Strains in Copper Conductor Lines: X-ray Microbeam Measurements and Analysis
Conference
·
OSTI ID:1009001
- Stanford
No abstract prepared.
- Research Organization:
- Argonne National Lab. (ANL), Argonne, IL (United States). Advanced Photon Source (APS)
- Sponsoring Organization:
- USDOE
- OSTI ID:
- 1009001
- Resource Relation:
- Conference: Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects;April 17 - 21, 2006;San Francisco, CA
- Country of Publication:
- United States
- Language:
- ENGLISH
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