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Title: Low thermal resistance power module assembly

Abstract

A power module assembly with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate with passageways or openings for coolant that extend through the plate from a lower surface to an upper surface. A circuit substrate is provided and positioned on the spreader plate to cover the coolant passageways. The circuit substrate includes a bonding layer configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer may be solder material which bonds to the upper surface of the plate to provide a continuous seal around the upper edge of each opening in the plate. The assembly includes power modules mounted on the circuit substrate on a surface opposite the bonding layer. The power modules are positioned over or proximal to the coolant passageways.

Inventors:
 [1];  [2];  [3]
  1. (Denver, CO)
  2. (Castle Rock, CO)
  3. (Arvada, CO)
Publication Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1007934
Patent Number(s):
7,190,581
Application Number:
11/032,771
Assignee:
Midwest Research Institute (Kansas City, MO) GFO
DOE Contract Number:
AC36-99GO10337
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Hassani, Vahab, Vlahinos, Andreas, and Bharathan, Desikan. Low thermal resistance power module assembly. United States: N. p., 2007. Web.
Hassani, Vahab, Vlahinos, Andreas, & Bharathan, Desikan. Low thermal resistance power module assembly. United States.
Hassani, Vahab, Vlahinos, Andreas, and Bharathan, Desikan. Tue . "Low thermal resistance power module assembly". United States. doi:. https://www.osti.gov/servlets/purl/1007934.
@article{osti_1007934,
title = {Low thermal resistance power module assembly},
author = {Hassani, Vahab and Vlahinos, Andreas and Bharathan, Desikan},
abstractNote = {A power module assembly with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate with passageways or openings for coolant that extend through the plate from a lower surface to an upper surface. A circuit substrate is provided and positioned on the spreader plate to cover the coolant passageways. The circuit substrate includes a bonding layer configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer may be solder material which bonds to the upper surface of the plate to provide a continuous seal around the upper edge of each opening in the plate. The assembly includes power modules mounted on the circuit substrate on a surface opposite the bonding layer. The power modules are positioned over or proximal to the coolant passageways.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Mar 13 00:00:00 EDT 2007},
month = {Tue Mar 13 00:00:00 EDT 2007}
}

Patent:

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  • A power module assembly (400) with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate (410) with passageways or openings (414) for coolant that extend through the plate from a lower surface (411) to an upper surface (412). A circuit substrate (420) is provided and positioned on the spreader plate (410) to cover the coolant passageways. The circuit substrate (420) includes a bonding layer (422) configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layermore » (422) may be solder material which bonds to the upper surface (412) of the plate to provide a continuous seal around the upper edge of each opening (414) in the plate. The assembly includes power modules (430) mounted on the circuit substrate (420) on a surface opposite the bonding layer (422). The power modules (430) are positioned over or proximal to the coolant passageways.« less
  • Abstract not provided.
  • A power module assembly of the type suitable for deployment in a vehicular power inverter, wherein the power inverter has a grounded chassis, is provided. The power module assembly comprises a conductive base layer electrically coupled to the chassis, an insulating layer disposed on the conductive base layer, a first conductive node disposed on the insulating layer, a second conductive node disposed on the insulating layer, wherein the first and second conductive nodes are electrically isolated from each other. The power module assembly also comprises a first capacitor having a first electrode electrically connected to the conductive base layer, andmore » a second electrode electrically connected to the first conductive node, and further comprises a second capacitor having a first electrode electrically connected to the conductive base layer, and a second electrode electrically connected to the second conductive node.« less
  • This patent describes a power module of the type including power cells arranged in alongitudinal stacked relation. Each power cell includes a frame, a gas-consuming cathode mounted at one end of the frame, a consumable anode, a flexible diaphragm mounting the anode in the frame to provide for longitudinal and annular movement of the anode as the anode is consumed. The flexible diaphragm cooperates with the frame to define a sealed expansion chamber on the side of the anode opposite the cathode, first means for introducing fluid under pressure into the expansion chamber to bias the anode toward the cathode,more » the flexible diaphragm cooperating with the frame to define a sealed flow passage between the anode and the cathode, second means for introducing electrolyte into the flow passage, means spacing and sealing adjacent cell frames providing separate passage means for soluble gas to the gas-consuming cathode, and third means for introducing soluble gas into the separate passage means.« less
  • A power module assembly of the electrochemical battery type is described. The assembly is formed of a plurality of individual monopolar cells which are mounted in stacked relation between a pair of end plates. Each cell is generally self-contained except for the electrolyte supply, and includes a slidably mounted anode which is held in constant contact with a cathode plate by a pressure bag assembly. The side faces of the anode are sealed against electrolyte flow so as to segregate adjacent cells against power robbing eddy currents.