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Title: Low thermal resistance power module assembly

Abstract

A power module assembly with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate with passageways or openings for coolant that extend through the plate from a lower surface to an upper surface. A circuit substrate is provided and positioned on the spreader plate to cover the coolant passageways. The circuit substrate includes a bonding layer configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer may be solder material which bonds to the upper surface of the plate to provide a continuous seal around the upper edge of each opening in the plate. The assembly includes power modules mounted on the circuit substrate on a surface opposite the bonding layer. The power modules are positioned over or proximal to the coolant passageways.

Inventors:
 [1];  [2];  [3]
  1. (Denver, CO)
  2. (Castle Rock, CO)
  3. (Arvada, CO)
Publication Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1007934
Patent Number(s):
7,190,581
Application Number:
11/032,771
Assignee:
Midwest Research Institute (Kansas City, MO) GFO
DOE Contract Number:  
AC36-99GO10337
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Hassani, Vahab, Vlahinos, Andreas, and Bharathan, Desikan. Low thermal resistance power module assembly. United States: N. p., 2007. Web.
Hassani, Vahab, Vlahinos, Andreas, & Bharathan, Desikan. Low thermal resistance power module assembly. United States.
Hassani, Vahab, Vlahinos, Andreas, and Bharathan, Desikan. Tue . "Low thermal resistance power module assembly". United States. doi:. https://www.osti.gov/servlets/purl/1007934.
@article{osti_1007934,
title = {Low thermal resistance power module assembly},
author = {Hassani, Vahab and Vlahinos, Andreas and Bharathan, Desikan},
abstractNote = {A power module assembly with low thermal resistance and enhanced heat dissipation to a cooling medium. The assembly includes a heat sink or spreader plate with passageways or openings for coolant that extend through the plate from a lower surface to an upper surface. A circuit substrate is provided and positioned on the spreader plate to cover the coolant passageways. The circuit substrate includes a bonding layer configured to extend about the periphery of each of the coolant passageways and is made up of a substantially nonporous material. The bonding layer may be solder material which bonds to the upper surface of the plate to provide a continuous seal around the upper edge of each opening in the plate. The assembly includes power modules mounted on the circuit substrate on a surface opposite the bonding layer. The power modules are positioned over or proximal to the coolant passageways.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Mar 13 00:00:00 EDT 2007},
month = {Tue Mar 13 00:00:00 EDT 2007}
}

Patent:

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