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Title: Method for making dense crack free thin films

Abstract

The process described herein provides a simple and cost effective method for making crack free, high density thin ceramic film. The steps involve depositing a layer of a ceramic material on a porous or dense substrate. The deposited layer is compacted and then the resultant laminate is sintered to achieve a higher density than would have been possible without the pre-firing compaction step.

Inventors:
 [1];  [2];  [1]
+ Show Author Affiliations
  1. (Lafayette, CA)
  2. (Berkeley, CA)
Publication Date:
Research Org.:
Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1007932
Patent Number(s):
7,163,713
Application Number:
10/162,511
Assignee:
The Regents of the University of California (Oakland, CA) OAK
DOE Contract Number:
AC03-76SF00098
Resource Type:
Patent
Country of Publication:
United States
Language:
English

Citation Formats

Jacobson, Craig P., Visco, Steven J., and De Jonghe, Lutgard C. Method for making dense crack free thin films. United States: N. p., 2007. Web.
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Jacobson, Craig P., Visco, Steven J., & De Jonghe, Lutgard C. Method for making dense crack free thin films. United States.
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Jacobson, Craig P., Visco, Steven J., and De Jonghe, Lutgard C. Tue . "Method for making dense crack free thin films". United States. doi:. https://www.osti.gov/servlets/purl/1007932.
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@article{osti_1007932,
title = {Method for making dense crack free thin films},
author = {Jacobson, Craig P. and Visco, Steven J. and De Jonghe, Lutgard C.},
abstractNote = {The process described herein provides a simple and cost effective method for making crack free, high density thin ceramic film. The steps involve depositing a layer of a ceramic material on a porous or dense substrate. The deposited layer is compacted and then the resultant laminate is sintered to achieve a higher density than would have been possible without the pre-firing compaction step.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jan 16 00:00:00 EST 2007},
month = {Tue Jan 16 00:00:00 EST 2007}
}
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  • ; ;
    The process described herein provides a simple and cost effective method for making crack free, high density thin ceramic film. The steps involve depositing a layer of a ceramic material on a porous or dense substrate. The deposited layer is compacted and then the resultant laminate is sintered to achieve a higher density than would have been possible without the pre-firing compaction step.

  • ; ;
    Provided are low-cost, mechanically strong, highly electronically conductive porous substrates and associated structures for solid-state electrochemical devices, techniques for forming these structures, and devices incorporating the structures. The invention provides solid state electrochemical device substrates of novel composition and techniques for forming thin electrode/membrane/electrolyte coatings on the novel or more conventional substrates. In particular, in one embodiment the invention provides techniques for firing of device substrate to form densified electrolyte/membrane films 5 to 20 microns thick. In another embodiment, densified electrolyte/membrane films 5 to 20 microns thick may be formed on a pre-sintered substrate by a constrained sintering process. Inmore » some cases, the substrate may be a porous metal, alloy, or non-nickel cermet incorporating one or more of the transition metals Cr, Fe, Cu and Ag, or alloys thereof.« less

  • Crack-free hydrides of zirconium and zirconium-uranium alloys are produced by alloying the zirconium or zirconium-uranium alloy with beryllium, or nickel, or beryllium and scandium, or nickel and scandium, or beryllium and nickel, or beryllium, nickel and scandium and thereafter hydriding.

  • Crack-free hydrides of zirconium and zirconium-uranium alloys are produced by alloying the zirconium or zirconium-uranium alloy with beryllium, or nickel, or beryllium and scandium, or nickel and scandium, or beryllium and nickel, or beryllium, nickel and scandium and thereafter hydriding.

  • ; ;
    Barrier layers and methods for forming barrier layers on a porous layer are provided. The methods can include chemically adsorbing a plurality of first molecules on a surface of the porous layer in a chamber and forming a first layer of the first molecules on the surface of the porous layer. A plasma can then be used to react a plurality of second molecules with the first layer of first molecules to form a first layer of a barrier layer. The barrier layers can seal the pores of the porous material, function as a diffusion barrier, be conformal, and/or havemore » a negligible impact on the overall ILD k value of the porous material.« less