Method for making dense crack free thin films

Title: Method for making dense crack free thin films

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Abstract

The process described herein provides a simple and cost effective method for making crack free, high density thin ceramic film. The steps involve depositing a layer of a ceramic material on a porous or dense substrate. The deposited layer is compacted and then the resultant laminate is sintered to achieve a higher density than would have been possible without the pre-firing compaction step.

Inventors:

Jacobson, Craig P. ^[1]; Visco, Steven J. ^[2]; De Jonghe, Lutgard C. ^[1]

(Lafayette, CA)
(Berkeley, CA)

Publication Date:: Tue Jan 16 00:00:00 EST 2007

Research Org.:: Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1007932

Patent Number(s):: 7,163,713

Application Number:: 10/162,511

Assignee:: The Regents of the University of California (Oakland, CA) OAK

DOE Contract Number:: AC03-76SF00098

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Citation Formats


                    Jacobson, Craig P., Visco, Steven J., and De Jonghe, Lutgard C. Method for making dense crack free thin films.  United States: N. p., 2007. 
        Web.

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                    Jacobson, Craig P., Visco, Steven J., & De Jonghe, Lutgard C. Method for making dense crack free thin films.  United States.

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                    Jacobson, Craig P., Visco, Steven J., and De Jonghe, Lutgard C. Tue .  
        "Method for making dense crack free thin films".  United States.  
        doi:.  https://www.osti.gov/servlets/purl/1007932.

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@article{osti_1007932,

  title        = {Method for making dense crack free thin films},

  author       = {Jacobson, Craig P. and Visco, Steven J. and De Jonghe, Lutgard C.},

  abstractNote = {The process described herein provides a simple and cost effective method for making crack free, high density thin ceramic film. The steps involve depositing a layer of a ceramic material on a porous or dense substrate. The deposited layer is compacted and then the resultant laminate is sintered to achieve a higher density than would have been possible without the pre-firing compaction step.},

  doi          = {},

  journal      = {},

  number       = ,

  volume       = ,

  place        = {United States},

  year         = {Tue Jan 16 00:00:00 EST 2007},

  month        = {Tue Jan 16 00:00:00 EST 2007}

}

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Structures for dense, crack free thin films

Jacobson, Craig P ; Visco, Steven J ; De Jonghe, Lutgard C

The process described herein provides a simple and cost effective method for making crack free, high density thin ceramic film. The steps involve depositing a layer of a ceramic material on a porous or dense substrate. The deposited layer is compacted and then the resultant laminate is sintered to achieve a higher density than would have been possible without the pre-firing compaction step.
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Provided are low-cost, mechanically strong, highly electronically conductive porous substrates and associated structures for solid-state electrochemical devices, techniques for forming these structures, and devices incorporating the structures. The invention provides solid state electrochemical device substrates of novel composition and techniques for forming thin electrode/membrane/electrolyte coatings on the novel or more conventional substrates. In particular, in one embodiment the invention provides techniques for firing of device substrate to form densified electrolyte/membrane films 5 to 20 microns thick. In another embodiment, densified electrolyte/membrane films 5 to 20 microns thick may be formed on a pre-sintered substrate by a constrained sintering process. Inmore »« less
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Jiang, Ying-Bing ; Cecchi, Joseph L ; Brinker, C Jeffrey

Barrier layers and methods for forming barrier layers on a porous layer are provided. The methods can include chemically adsorbing a plurality of first molecules on a surface of the porous layer in a chamber and forming a first layer of the first molecules on the surface of the porous layer. A plasma can then be used to react a plurality of second molecules with the first layer of first molecules to form a first layer of a barrier layer. The barrier layers can seal the pores of the porous material, function as a diffusion barrier, be conformal, and/or havemore »« less
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