Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Method for making dense crack free thin films

Patent ·
OSTI ID:1007932
The process described herein provides a simple and cost effective method for making crack free, high density thin ceramic film. The steps involve depositing a layer of a ceramic material on a porous or dense substrate. The deposited layer is compacted and then the resultant laminate is sintered to achieve a higher density than would have been possible without the pre-firing compaction step.
Research Organization:
Lawrence Berkeley National Laboratory (LBNL), Berkeley, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC03-76SF00098;
Assignee:
The Regents of the University of California (Oakland, CA)
Patent Number(s):
7,163,713
Application Number:
10/162,511
OSTI ID:
1007932
Country of Publication:
United States
Language:
English

References (1)

Improved preparation procedure and properties for a multilayer piezoelectric thick-film actuator journal November 1998

Similar Records

Structures for dense, crack free thin films
Patent · 2011 · OSTI ID:1016543

Process for making dense thin films
Patent · 2005 · OSTI ID:1175435

Colloidal spray method for low cost thin coating deposition
Patent · 2001 · OSTI ID:874290

Related Subjects