Investigation of Transferred-Arc Cleaning for Thin Film Removal
Transferred-arc cleaning is being investigated as a precision cleaning method for thin films on electrically conducting substrates as well as the traditional cleaning and roughening pretreatment for LPPS. Transferred-arc cleaning of copper substrates has been studied to identify the effect of processing conditions on cleaning and roughening characteristics. A Box-Behnken response surface design experiment varying the chamber pressure, substrate standoff distance, and torch current while observing the transferred arc voltage, voltage fluctuation, current, emitted light, and surface cleanliness was performed. The result of the analysis show the effect of the various independent variables on the measured responses. Distinct stages in the cleaning process are identified by their sample cleanliness, voltage level, voltage fluctuation, emitted light, and erosion rate.
- Research Organization:
- Los Alamos National Lab. (LANL), Los Alamos, NM (United States)
- Sponsoring Organization:
- USDOE Office of Defense Programs (DP) (US)
- DOE Contract Number:
- W-7405-ENG-36
- OSTI ID:
- 759786
- Report Number(s):
- LA-UR-98-4509; TRN: AH200028%%135
- Resource Relation:
- Conference: United Thermal Spray Conference, Dusseldorf (DE), 03/17/1998--03/19/1998; Other Information: PBD: 17 Mar 1998
- Country of Publication:
- United States
- Language:
- English
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