Prediction of Tungsten CMP Pad Life Using Blanket Removal Rate Data and Endpoint Data Obtained from Process Temperature and Carrier Motor Current Measurments
Several techniques to predict pad failure during tungsten CMP were investigated for a specific consumable set. These techniques include blanket polish rate measurements and metrics derived from two endpoint detection schemes. Blanket polish rate decreased significantly near pad failure. Metrics from the thermal endpoint technique included change in peak temperature, change in the time to reach peak temperature, and the change in the slope of the temperature trace just prior to peak temperature all as a function of pad life. Average carrier motor current before endpoint was also investigated. Changes in these metrics were observed however these changes, excluding time to peak process temperature, were either not consistent between pads or too noisy to be reliable predictors of pad failure.
- Research Organization:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 7242
- Report Number(s):
- SAND99-1181C; ON: DE00007242
- Resource Relation:
- Conference: SPIE Symposium on Microelectronics Manufacturing Technologies; Edinburgh, Scotland; 05/19-21/1999
- Country of Publication:
- United States
- Language:
- English
Similar Records
Quantitative analysis of physical and chemical changes in CMP polyurethane pad surfaces
Role of alumina phase and size in tungsten CMP