Enhancing thermal conductivity of fluids with nanoparticles
Low thermal conductivity is a primary limitation in the development of energy-efficient heat transfer fluids that are required in many industrial applications. In this paper we propose that an innovative new class of heat transfer fluids can be engineered by suspending metallic nanoparticles in conventional heat transfer fluids. The resulting {open_quotes}nanofluids{close_quotes} are expected to exhibit high thermal conductivities compared to those of currently used heat transfer fluids, and they represent the best hope for enhancement of heat transfer. The results of a theoretical study of the thermal conductivity of nanofluids with copper nanophase materials are presented, the potential benefits of the fluids are estimated, and it is shown that one of the benefits of nanofluids will be dramatic reductions in heat exchanger pumping power.
- Research Organization:
- Argonne National Lab. (ANL), Argonne, IL (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- W-31109-ENG-38
- OSTI ID:
- 196525
- Report Number(s):
- ANL/MSD/CP-84938; CONF-951135-29; ON: DE96004174; TRN: 96:001707
- Resource Relation:
- Conference: 1995 International mechanical engineering congress and exhibition, San Francisco, CA (United States), 12-17 Nov 1995; Other Information: PBD: Oct 1995
- Country of Publication:
- United States
- Language:
- English
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