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Title: Using infrared thermography for the study of heat transfer through building envelope components

Conference ·
OSTI ID:10183858
; ; ;  [1];  [2]
  1. Lawrence Berkeley Lab., CA (United States)
  2. California Polytechnic Univ., San Luis Obispo, CA (United States). Dept. of Engineering Technology

Heat transfer through building envelope components is typically characterized by one number, the conductance. Such a characterization is best suited for homogeneous samples since it does not quantify or illustrate spatial variations within a sample. However, the growing use of advanced wall and window insulations with existing framing materials has increased the importance of understanding spatial heat transfer effects within building envelope components. An infrared thermography laboratory has been established to provide detailed quantitative and qualitative information on the spatial heat transfer effects of building envelope materials. The use of this facility for more effective product development and more accurate product development and more accurate product characterization is discussed.

Research Organization:
Lawrence Berkeley Lab., CA (United States)
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
AC03-76SF00098; AI79-86BP63401
OSTI ID:
10183858
Report Number(s):
LBL-29752; CONF-920108-3; ON: DE93000636; IN: TA-287
Resource Relation:
Conference: 1992 winter meeting of the American Society of Heating, Refrigerating and Air-Conditioning Engineers (ASHRAE),Anaheim, CA (United States),25-29 Jan 1992; Other Information: PBD: Nov 1991
Country of Publication:
United States
Language:
English