Current development in selected stress and thermal analysis software interfaces with PRO-ENGINEER
Ever since PRO-ENGINEER has become a dominating CAD package available to the public, some of us have been saying, ``Gee, if only I could export my geometry to a stress analysis program without having to recreate any of the details already created, wouldn`t that be spectacular?`` Well, much to the credit of the major stress and thermal analysis software vendors, some of them have been listening to design engineers like me badger them to furnish a seamless interface between PRO and their stress analysis programs. The down side of this problem is the fact that a lot of problems still exist with most of the vendors and their interfaces. I want to discuss the interfaces that I feel are currently ``State of the Art``, and how they are developing and the future for finally arriving at a transparent procedure that an engineer at a workstation can utilize in his or her design process. In years past, engineers would develop a design and changes would evolve based on intuition, or somebody else`s critical evaluation. Then the design would be forwarded to the production group, or the stress analysis group for further evaluation and analysis. Maybe data from a preliminary prototype would be collected and an evaluation report made. All of this took time and increased the cost of the item to be manufactured. Today, the engineer must assume responsibility for design and functional capability early on in the design process, if for no other reason than costs associated with diverse channels of critiquing. For that reason, one place to enhance the design process is to have the ability to do preliminary stress and thermal analysis during the initial design phase. This is both cost and time effective. But, as I am sure you are aware, this has been easier said than done.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 10162049
- Report Number(s):
- SAND-93-1327C; CONF-9306173-1; ON: DE93014935
- Resource Relation:
- Conference: Pro-users meeting,Orlando, FL (United States),9 Jun 1993; Other Information: PBD: [1993]
- Country of Publication:
- United States
- Language:
- English
Similar Records
Summary of Glue Tests 1993
PG&E WaveConnect Program Final Report