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Title: Shock-induced spall in copper: the effects of anisotropy, temperature, loading pulse and defect

Journal Article ·
DOI:https://doi.org/10.1063/1.3294971· OSTI ID:991255

Shock-induced spall in Cu is investigated with molecular dynamics simulations. We examine spallation in initially perfect crystals and defective solids with grain boundaries (columnar bicrystals), stacking faults or vacancies, as well as the effect of temperature and loading pulses. Spall in single crystal Cu is anisotropic, and defects and high temperature may reduce the spall strength. Taylor-wave (triangular shock-release wave) loading is explored in comparison with square wave shock loading.

Research Organization:
Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
AC52-06NA25396
OSTI ID:
991255
Report Number(s):
LA-UR-09-04786; LA-UR-09-4786; TRN: US201021%%133
Country of Publication:
United States
Language:
English