Fermilab Failure Analysis of TeV I (TIE) Array Soldier Joints

Technical Report · Wed Sep 02 00:00:00 EDT 1987

DOI:https://doi.org/10.2172/984624· OSTI ID:984624

Runge-Marchese, Jude M. ^[1]; Daehn, Ralph C. ^[1]

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1. Fermilab

Failure of TIE array loop assembly solder joints within Stochastic Cooling Tanks during system operation resulted in the loop base plate dropping into the beam region. This caused a non-operational condition to exist within the system. In order to understand the failure mechanism, several loop assemblies were submitted to Midwest Materials and Engineering Consultants for complete metallurgical evaluation and failure analysis. Because of the similarity between the loop assembly material construction and the TIE resistor assemblies, several resistor assemblies were also evaluated.

• Research Organization: Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
• Sponsoring Organization: USDOE Office of Science (SC), High Energy Physics (HEP)
• DOE Contract Number: AC02-07CH11359
• OSTI ID: 984624
• Report Number(s): FERMILAB-PBAR-NOTE-472; oai:inspirehep.net:863459; TRN: US201016%%1536
• Country of Publication: United States
• Language: English

Related Subjects

43 PARTICLE ACCELERATORS
CONSTRUCTION
CONSULTANTS
EVALUATION
FAILURES
FAILURE MODE ANALYSIS
FERMILAB
PLATES
RESISTORS
SOLDERED JOINTS
STOCHASTIC COOLING
TANKS
Accelerators