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Title: Sensitivity of Solder Joint Fatigue to Sources of Variation in Advanced Vehicular Power Electronics Cooling

Abstract

This paper demonstrates a methodology for taking variation into account in thermal and fatigue analyses of the die attach for an inverter of an electric traction drive vehicle. This method can be used to understand how variation and mission profile affect parameters of interest in a design. Three parameters are varied to represent manufacturing, material, and loading variation: solder joint voiding, aluminum nitride substrate thermal conductivity, and heat generation at the integrated gate bipolar transistor. The influence of these parameters on temperature and solder fatigue life is presented. The heat generation loading variation shows the largest influence on the results for the assumptions used in this problem setup.

Authors:
;
Publication Date:
Research Org.:
National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
982528
Report Number(s):
NREL/CP-540-46417
TRN: US201014%%360
DOE Contract Number:  
AC36-08GO28308
Resource Type:
Conference
Resource Relation:
Conference: Presented at the 2009 ASME International Mechanical Engineering Conference and Exposition, 13-19 November 2009, Lake Buena Vista, Florida
Country of Publication:
United States
Language:
English
Subject:
33 ADVANCED PROPULSION SYSTEMS; 42 ENGINEERING; ALUMINIUM; DESIGN; INVERTERS; MANUFACTURING; MECHANICAL ENGINEERING; NITRIDES; SENSITIVITY; SUBSTRATES; THERMAL CONDUCTIVITY; POWER ELECTRONICS; POWER ELECTRONICS COOLING; SOLDER JOINT FATIGUE ANALYSIS; Transportation

Citation Formats

Vlahinos, A, and O'Keefe, M. Sensitivity of Solder Joint Fatigue to Sources of Variation in Advanced Vehicular Power Electronics Cooling. United States: N. p., 2010. Web. doi:10.1115/IMECE2009-11443.
Vlahinos, A, & O'Keefe, M. Sensitivity of Solder Joint Fatigue to Sources of Variation in Advanced Vehicular Power Electronics Cooling. United States. https://doi.org/10.1115/IMECE2009-11443
Vlahinos, A, and O'Keefe, M. 2010. "Sensitivity of Solder Joint Fatigue to Sources of Variation in Advanced Vehicular Power Electronics Cooling". United States. https://doi.org/10.1115/IMECE2009-11443. https://www.osti.gov/servlets/purl/982528.
@article{osti_982528,
title = {Sensitivity of Solder Joint Fatigue to Sources of Variation in Advanced Vehicular Power Electronics Cooling},
author = {Vlahinos, A and O'Keefe, M},
abstractNote = {This paper demonstrates a methodology for taking variation into account in thermal and fatigue analyses of the die attach for an inverter of an electric traction drive vehicle. This method can be used to understand how variation and mission profile affect parameters of interest in a design. Three parameters are varied to represent manufacturing, material, and loading variation: solder joint voiding, aluminum nitride substrate thermal conductivity, and heat generation at the integrated gate bipolar transistor. The influence of these parameters on temperature and solder fatigue life is presented. The heat generation loading variation shows the largest influence on the results for the assumptions used in this problem setup.},
doi = {10.1115/IMECE2009-11443},
url = {https://www.osti.gov/biblio/982528}, journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Jun 01 00:00:00 EDT 2010},
month = {Tue Jun 01 00:00:00 EDT 2010}
}

Conference:
Other availability
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