Apparatus and method for electroforming high aspect ratio micro-parts
Patent
·
OSTI ID:971537
- Stockton, CA
- Rancho Cucamonga, CA
- Manteca, CA
A fixture is disclosed to more easily affix a workpiece in the proper orientation and spacing with sealed electrical interconnection within an electrochemical plating bath. The workpiece can be any planar metallic or non-metallic substrate such as a silicon wafer commonly used in LIGA or microsystem fabrication. The fixture described allows the workpiece to be submerged deep within an electrolytic cell, facing upwards, and allows easy transfer from one cell to another. The edges, backside, and electrical connections are sealed and protected from the electrolyte.
- Research Organization:
- Sandia National Lab. (SNL-CA), Livermore, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- Assignee:
- Sandia Corporation (Livermore, CA)
- Patent Number(s):
- 7,608,174
- Application Number:
- 11/599,766
- OSTI ID:
- 971537
- Country of Publication:
- United States
- Language:
- English
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