Mold heating and cooling microprocessor conversion. Final report

Hoffman, D P

doi:10.2172/95354

Title: Mold heating and cooling microprocessor conversion. Final report

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Abstract

Conversion of the microprocessors and software for the Mold Heating and Cooling (MHAC) pump package control systems was initiated to allow required system enhancements and provide data communications capabilities with the Plastics Information and Control System (PICS). The existing microprocessor-based control systems for the pump packages use an Intel 8088-based microprocessor board with a maximum of 64 Kbytes of program memory. The requirements for the system conversion were developed, and hardware has been selected to allow maximum reuse of existing hardware and software while providing the required additional capabilities and capacity. The new hardware will incorporate an Intel 80286-based microprocessor board with an 80287 math coprocessor, the system includes additional memory, I/O, and RS232 communication ports.

Authors:: Hoffman, D P

Publication Date:: Sat Jul 01 00:00:00 EDT 1995

Research Org.:: Allied-Signal Aerospace Co., Kansas City, MO (United States)

Sponsoring Org.:: USDOE, Washington, DC (United States)

OSTI Identifier:: 95354

Report Number(s):: KCP-613-5516
ON: DE95015450

DOE Contract Number:: AC04-76DP00613

Resource Type:: Technical Report

Resource Relation:: Other Information: PBD: Jul 1995

Country of Publication:: United States

Language:: English

Subject:: 42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; 99 MATHEMATICS, COMPUTERS, INFORMATION SCIENCE, MANAGEMENT, LAW, MISCELLANEOUS; MICROPROCESSORS; MODIFICATIONS; COMPUTERIZED CONTROL SYSTEMS; PUMPS; PROGRESS REPORT; MOLDING; ELECTRIC CONTROLLERS; DESIGN; COMPUTER ARCHITECTURE

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                    Hoffman, D P. Mold heating and cooling microprocessor conversion. Final report.  United States: N. p., 1995. 
        Web.  doi:10.2172/95354.

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                    Hoffman, D P. Mold heating and cooling microprocessor conversion. Final report.  United States.  https://doi.org/10.2172/95354

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                    Hoffman, D P. 1995.  
        "Mold heating and cooling microprocessor conversion. Final report".  United States.  https://doi.org/10.2172/95354.  https://www.osti.gov/servlets/purl/95354.

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@article{osti_95354,

  title        = {Mold heating and cooling microprocessor conversion. Final report},

  author       = {Hoffman, D P},

  abstractNote = {Conversion of the microprocessors and software for the Mold Heating and Cooling (MHAC) pump package control systems was initiated to allow required system enhancements and provide data communications capabilities with the Plastics Information and Control System (PICS). The existing microprocessor-based control systems for the pump packages use an Intel 8088-based microprocessor board with a maximum of 64 Kbytes of program memory. The requirements for the system conversion were developed, and hardware has been selected to allow maximum reuse of existing hardware and software while providing the required additional capabilities and capacity. The new hardware will incorporate an Intel 80286-based microprocessor board with an 80287 math coprocessor, the system includes additional memory, I/O, and RS232 communication ports.},

  doi          = {10.2172/95354},

  url          = {https://www.osti.gov/biblio/95354},
  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {Sat Jul 01 00:00:00 EDT 1995},

  month        = {Sat Jul 01 00:00:00 EDT 1995}

}

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