Design of Experiments to Determine Causes of Flex Cable Solder Wicking, Discoloration and Hole Location Defects
Design of Experiments (DoE) were developed and performed in an effort to discover and resolve the causes of three different manufacturing issues; large panel voids after Hot Air Solder Leveling (HASL), cable hole locations out of tolerance after lamination and delamination/solder wicking around flat flex cable circuit lands after HASL. Results from a first DoE indicated large panel voids could be eliminated by removing the pre-HASL cleaning. It also revealed eliminating the pre-HASL bake would not be detrimental when using a hard press pad lamination stackup. A second DoE indicated a reduction in hard press pad stackup lamination pressure reduced panel stretch in the y axis approximately 70%. A third DoE illustrated increasing the pre-HASL bake temperature could reduce delamination/solder wicking when using a soft press pad lamination stackup.
- Research Organization:
- Kansas City Plant (KCP), Kansas City, MO
- Sponsoring Organization:
- USDOE National Nuclear Security Administration (NA)
- DOE Contract Number:
- DE-AC04-01AL66850
- OSTI ID:
- 952623
- Report Number(s):
- KCP-613-8569; TRN: US200915%%6
- Country of Publication:
- United States
- Language:
- English
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