Sensor/ROIC Integration using Oxide Bonding
Conference
·
OSTI ID:951651
We explore the Ziptronix Direct Bond Interconnect (DBI) technology [2] for the integration of sensors and readout integrated circuits (ROICs) for high energy physics. The technology utilizes an oxide bond to form a robust mechanical connection between layers which serves to assist with the formation of metallic interlayer connections. We report on testing results of sample sensors bonded to ROICs and thinned to 100 {micro}m.
- Research Organization:
- Fermi National Accelerator Lab. (FNAL), Batavia, IL (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC02-07CH11359
- OSTI ID:
- 951651
- Report Number(s):
- FERMILAB-CONF-08-604-E; arXiv eprint number arXiv:0902.2801; TRN: US0902259
- Resource Relation:
- Conference: Talk given at International Linear Collider Workshop (LCWS08 and ILC08), Chicago, Illinois, 16-20 Nov 2008
- Country of Publication:
- United States
- Language:
- English
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