Strength of Si Wafers with Microcracks: A Theoretical Model (Poster)
A new analytical expression that takes into account the surface, edge, and bulk properties of a wafer has been proposed to describe the strength of the brittle materials. A new proposed fracture-mechanics numerical simulation successfully predicted the strength of the cast silicon wafers. It has been shown that the predicted wafer strength distribution agrees well with the available experimental results.
- Research Organization:
- National Renewable Energy Lab. (NREL), Golden, CO (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC36-99-GO10337
- OSTI ID:
- 939516
- Report Number(s):
- NREL/PO-520-43306; TRN: US200823%%230
- Resource Relation:
- Conference: Presented at the 33rd IEEE Photovoltaic Specialist Conference, 11-16 May 2008, San Diego, California
- Country of Publication:
- United States
- Language:
- English
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