Compliant layer chucking surface

Patent · Tue Dec 28 00:00:00 EST 2004

OSTI ID:921909

Blaedel, Kenneth L ^[1]; Spence, Paul A ^[2]; Thompson, Samuel L ^[2]

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1. Dublin, CA
2. Pleasanton, CA

A method and apparatus are described wherein a thin layer of complaint material is deposited on the surface of a chuck to mitigate the deformation that an entrapped particle might cause in the part, such as a mask or a wafer, that is clamped to the chuck. The harder particle will embed into the softer layer as the clamping pressure is applied. The material composing the thin layer could be a metal or a polymer for vacuum or electrostatic chucks. It may be deposited in various patterns to affect an interrupted surface, such as that of a "pin" chuck, thereby reducing the probability of entrapping a particle.

• Research Organization: Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: W-7405-ENG-48
• Assignee: EUV LLC (Santa Clara, CA)
• Patent Number(s): 6,835,415
• Application Number: 10/338,266
• OSTI ID: 921909
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE