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Title: Microelectromechanical systems contact stress sensor

Patent ·
OSTI ID:921497
 [1]
  1. Oakland, CA
+ Show Author Affiliations

A microelectromechanical systems stress sensor comprising a microelectromechanical systems silicon body. A recess is formed in the silicon body. A silicon element extends into the recess. The silicon element has limited freedom of movement within the recess. An electrical circuit in the silicon element includes a piezoresistor material that allows for sensing changes in resistance that is proportional to bending of the silicon element.

Research Organization:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
W-7405-ENG-48
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA)
Patent Number(s):
7,311,009
Application Number:
11/143,543
OSTI ID:
921497
Country of Publication:
United States
Language:
English

References (7)

A miniature piezoelectric polymer transducer for in vitro measurement of the dynamic contact stress distribution journal June 1992
Development of a new contact-type piezoresistive micro-shear-stress sensor
  • Hsieh, M. C.; Fang, Yean-Kuen; Ju, M. S.
  • Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, SPIE Proceedings https://doi.org/10.1117/12.462822
conference April 2002
Flexible miniature ribbon cables for long-term connection to implantable sensors journal April 1990
New tactile sensor chip with silicone rubber cover journal September 2000
Silicon ribbon cables for chronically implantable microelectrode arrays journal April 1994
A flexible MEMS technology and its first application to shear stress sensor skin
  • Proceedings IEEE The Tenth Annual International Workshop on Micro Electro Mechanical Systems. An Investigation of Micro Structures, Sensors, Actuators, Machines and Robots https://doi.org/10.1109/MEMSYS.1997.581894
conference January 1997
Review Article Tactile sensing for mechatronics—a state of the art survey journal February 1999

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