Thermal and mechanical joints to cryo-cooled silicon monochromatorcrystals
Conference
·
OSTI ID:920157
We describe the performance of various materials used as thethermal interface between silicon to silicon and silicon to copper jointswhen operated at ~;120K and loaded with ~;20 watts of thermal power. Wefind that only the indium based silicon-to-silicon joint isreliable.
- Research Organization:
- Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
- Sponsoring Organization:
- USDOE Director. Office of Science. Basic EnergySciences
- DOE Contract Number:
- DE-AC02-05CH11231
- OSTI ID:
- 920157
- Report Number(s):
- LBNL-61087; R&D Project: A580ES; BnR: KC0204016; TRN: US200818%%1080
- Resource Relation:
- Conference: Advances in X-ray/EUV optics, components andapplications, San Diego, 13-17 Aug 2006
- Country of Publication:
- United States
- Language:
- English
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