LIGA microsystems aging : evaluation and mitigation.
The deployment of LIGA structures in DP applications requires a thorough understanding of potential long term physical and chemical changes that may occur during service. While these components are generally fabricated from simple metallic systems such as copper, nickel and nickel alloys, the electroplating process used to form them creates microstructural features which differ from those found in conventional (e.g. ingot metallurgy) processing of such materials. Physical changes in non-equilibrium microstructures may occur due to long term exposure to temperatures sufficient to permit atomic and vacancy mobility. Chemical changes, particularly at the surfaces of LIGA parts, may occur in the presence of gaseous chemical species (e.g. water vapor, HE off-gassing compounds) and contact with other metallic structures. In this study, we have characterized the baseline microstructure of several nickel-based materials that are used to fabricate LIGA structures. Solute content and distribution was found to have a major effect on the electroplated microstructures. Microstructural features were correlated to measurements of hardness and tensile strength. Dormancy testing was conducted on one of the baseline compositions, nickel-sulfamate. Groups of specimens were exposed to controlled thermal cycles; subsequent examinations compared properties of 'aged' specimens to the baseline conditions. Results of our testing indicate that exposure to ambient temperatures (-54 C to 71 C) do not result in microstructural changes that might be expected to significantly effect mechanical performance. Additionally, no localized changes in surface appearance were found as a result of contact between electroplated parts.
- Research Organization:
- Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 918229
- Report Number(s):
- SAND2003-8800; TRN: US200818%%317
- Country of Publication:
- United States
- Language:
- English
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