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Title: A novel method to synthesize high purity, nanostructured copper

Journal Article · · Materials Science and Engineering A, vol. 429, N/A, August 1, 2006, pp. 272-276
OSTI ID:898589

Nanostructured high purity (99.999%) copper foils, 10 cm in diameter and 22-25 microns thick were produced using nanoscale multilayer technology. The foils were produced using five different layer thicknesses ranging from 1.25 to 43.6 nm (18,000 to 520 layers). This process delivers the ability to produce multiple large-scale samples during a single deposition run with very small residual stresses. Tensile and indentation tests demonstrate that the material produced is a high strength copper ({sigma}{sub y} {approx} 540-690 MPa).

Research Organization:
Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
Sponsoring Organization:
USDOE
DOE Contract Number:
W-7405-ENG-48
OSTI ID:
898589
Report Number(s):
UCRL-JRNL-215145; TRN: US200706%%224
Journal Information:
Materials Science and Engineering A, vol. 429, N/A, August 1, 2006, pp. 272-276, Journal Name: Materials Science and Engineering A, vol. 429, N/A, August 1, 2006, pp. 272-276
Country of Publication:
United States
Language:
English