Microchannel devices
The fabrication of stainless steel microchannel heat exchangers was examined through microlamination, the process of diffusion bonding precision machined metallic foils. The influence of diffusion bonding parameters, as well as the device geometry on the strength of the bond between the foils and embedded channel integrity, was investigated. During diffusion bonding, high temperatures and/or pressures result in well bonded foils, but these conditions cause the embedded channels to deform, which will degrade the efficiency of fluid flow through the channels. Alternatively, low temperatures and/or pressures result in undeformed channels but weakly bonded foils. This causes failure of the device due to fluid leakage. Thus, a processing envelope exists for producing a sound device with no fluid leakage and no degradation of fluid flow properties. The theoretical limit on aspect ratio within two-fluid counter-flow microchannel heat exchangers was also investigated. A counter-flow device is comprised of alternating layers of microchannels, which allow the two fluids to flow in opposite directions separated by fins. A theoretical model for interpreting the span of the fin as a function of the fin thickness was established. The model was verified experimentally by fabricating specimens to simulate the counter-flow device. The results of these investigations were used to aid in the design and processing of prototype microchannel devices.
- Research Organization:
- Albany Research Center (ARC), Albany, OR (United States)
- Sponsoring Organization:
- USDOE - Office of Fossil Energy (FE)
- OSTI ID:
- 897006
- Report Number(s):
- DOE/ARC-2001-011; ORNL/TM-2001/174 (proceedings); TRN: US200704%%162
- Resource Relation:
- Conference: 15th Annual Fossil Energy Materials Conference, April 30-May 2, 2001; Related Information: Information in this paper is covered by US Patnt 6,672,502, granted 1/6/2004.
- Country of Publication:
- United States
- Language:
- English
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