Development of a Low Loss, High Dielectric Strength Microwave Substrate
This work describes a comparison of two candidate materials for pulse forming line fabrication with respect to bulk dielectric breakdown, frequency response of relative permittivity and dielectric loss. One material is a commercially available microwave substrate material that can be procured in sheet form without a high voltage specification while the other is a newly developed material that also comes in sheet form that can also be cast between the electrodes.
- Research Organization:
- Lawrence Livermore National Lab. (LLNL), Livermore, CA (United States)
- Sponsoring Organization:
- USDOE
- DOE Contract Number:
- W-7405-ENG-48
- OSTI ID:
- 896286
- Report Number(s):
- UCRL-PROC-222059; TRN: US0700756
- Resource Relation:
- Conference: Presented at: 2006 Power Modulator Conference, Washington , DC, United States, May 13 - May 18, 2006
- Country of Publication:
- United States
- Language:
- English
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