Enhanced adhesion for LIGA microfabrication by using a buffer layer

Patent · Mon Jan 01 00:00:00 EST 2001

OSTI ID:873943

Bajikar, Sateesh S ^[1]; De Carlo, Francesco ^[2]; Song, Joshua J ^[3]

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1. San Jose, CA
2. Darien, IL
3. Naperville, IL

The present invention is an improvement on the LIGA microfabrication process wherein a buffer layer is applied to the upper or working surface of a substrate prior to the placement of a resist onto the surface of the substrate. The buffer layer is made from an inert low-Z material (low atomic weight), a material that absorbs secondary X-rays emissions from the substrate that are generated from the substrate upon exposure to a primary X-rays source. Suitable materials for the buffer layer include polyamides and polyimide. The preferred polyimide is synthesized form pyromellitic anhydride and oxydianiline (PMDA-ODA).

• Research Organization: Argonne National Laboratory (ANL), Argonne, IL (United States)
• DOE Contract Number: W-31109-ENG-38
• Assignee: United States of America as represented by United States Department (Washington, DC)
• Patent Number(s): US 6277539
• OSTI ID: 873943
• Country of Publication: United States
• Language: English

Related Subjects

enhanced
adhesion
liga
microfabrication
buffer
layer
improvement
process
applied
upper
surface
substrate
prior
placement
resist
inert
low-z
material
atomic
weight
absorbs
secondary
x-rays
emissions
generated
exposure
primary
source
suitable
materials
polyamides
polyimide
preferred
synthesized
form
pyromellitic
anhydride
oxydianiline
pmda-oda
atomic weight
primary x-rays
low-z material
suitable material
buffer layer
fabrication process
secondary x-rays
suitable materials
substrate prior
enhanced adhesion
liga microfabrication
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