Temperature measuring device

Patent · Fri Jan 01 00:00:00 EST 1999

OSTI ID:872599

Lauf, Robert J ^[1]; Bible, Don W ^[2]; Sohns, Carl W ^[1]

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1. Oak Ridge, TN
2. Clinton, TN

Systems and methods are described for a wireless instrumented silicon wafer that can measure temperatures at various points and transmit those temperature readings to an external receiver. The device has particular utility in the processing of semiconductor wafers, where it can be used to map thermal uniformity on hot plates, cold plates, spin bowl chucks, etc. without the inconvenience of wires or the inevitable thermal perturbations attendant with them.

• Research Organization: Sandia National Laboratories (SNL), Albuquerque, NM, and Livermore, CA (United States)
• DOE Contract Number: AC04-76
• Assignee: Lockheed Martin Energy Research Corporation (Oak Ridge, TN)
• Patent Number(s): US 5969639
• OSTI ID: 872599
• Country of Publication: United States
• Language: English

Related Subjects

temperature
measuring
device
systems
methods
described
wireless
instrumented
silicon
wafer
measure
temperatures
various
transmit
readings
external
receiver
particular
utility
processing
semiconductor
wafers
map
thermal
uniformity
hot
plates
cold
spin
bowl
chucks
etc
inconvenience
wires
inevitable
perturbations
attendant
semiconductor wafers
temperature measuring
semiconductor wafer
measuring device
silicon wafer
particular utility
temperature reading
cold plates
cold plate
measure temperature
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