Electroless copper plating
Patent
·
OSTI ID:872041
- Lee's Summit, MO
An optimized electroless copper plating technique suitable for plating electroless copper upon ceramics.
- Research Organization:
- Kansas City Plant (KCP), Kansas City, MO (United States)
- DOE Contract Number:
- AC04-76DP00613
- Assignee:
- AlliedSignal Inc. (Morristown, NJ)
- Patent Number(s):
- US 5849355
- Application Number:
- 08/717,195
- OSTI ID:
- 872041
- Country of Publication:
- United States
- Language:
- English
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