Electroless copper plating
Abstract
An optimized electroless copper plating technique suitable for plating electroless copper upon ceramics.
- Inventors:
-
- Lee's Summit, MO
- Publication Date:
- Research Org.:
- Kansas City Plant (KCP), Kansas City, MO (United States)
- OSTI Identifier:
- 872041
- Patent Number(s):
- US 5849355
- Application Number:
- 08/717,195
- Assignee:
- AlliedSignal Inc. (Morristown, NJ)
- DOE Contract Number:
- AC04-76DP00613
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- electroless; copper; plating; optimized; technique; suitable; ceramics; electroless copper; copper plating; /427/29/333/
Citation Formats
McHenry, Michael R. Electroless copper plating. United States: N. p., 1998.
Web.
McHenry, Michael R. Electroless copper plating. United States.
McHenry, Michael R. 1998.
"Electroless copper plating". United States. https://www.osti.gov/servlets/purl/872041.
@article{osti_872041,
title = {Electroless copper plating},
author = {McHenry, Michael R},
abstractNote = {An optimized electroless copper plating technique suitable for plating electroless copper upon ceramics.},
doi = {},
url = {https://www.osti.gov/biblio/872041},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Dec 15 00:00:00 EST 1998},
month = {Tue Dec 15 00:00:00 EST 1998}
}
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